IEC 61967-2 PDF

Mazuran The primary factor affecting the measured RF voltage is the septum to IC test board cell wall spacing. If you need help with the purchase or have any queries please email enquiries standards. This service is not available if you are a URL user where you do log in with an email address. You may experience issues viewing this site in Internet Explorer 9, 10 or A web subscription provides an easy and secure access to standards, and you are guaranteed to always have the latest edition.

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This procedure does not simulate the effects of impacts received during transportation as loosely constrained cargo. Where the effects of loose cargo transportation are to be assessed, test Ee: Bounce should be used. Also this procedure does not simulate the effects of shock applied to installed equipments. Where this effect is to be assessed refer to test Ea: Shock. Testing should only be specified for equipment likely to receive such rough handling, for example those of small to medium size and mass, and should only be applied to those faces and corners where there is a risk of such treatment being encountered.

In general, equipment which is frequently handled and serviced for example field equipment and unit spares can be considered at risk, whereas equipment forming an integral part of a permanent installation would not normally be considered at risk and need not be tested. Testing may not be applicable to fragile unprotected equipment of irregular shape for example aircraft nose radar which, when removed from the installation would be contained in a handling frame or jig.

It may however be applicable to these items of equipment when they are in their transit case or in their handling frame or jig. For equipment which stands only on one face for example the normal base the test is generally only applied to that face. Shock tests are performed on the specimen when fixed to the test machine. Drop and topple, free fall, repeated free fall and bounce tests are performed with the specimen free. This second edition cancels and replaces the first edition, published in and constitutes a technical revision.

The major changes with regard to the previous edition concern the introduction of soft packaging tests, where appropriate. Has the status of a basic safety publication in accordance with IEC Guide


IEC 61967-2

Most recent IEC Ed. The test board is not inside the cell, as in the conventional usage, but becomes a part of the cell wall. This method is applicable to any TEM or GTEM cell modified to incorporate the wall port; however, the measured radio frequency RF voltage will be affected by many factors. The primary factor affecting the measured RF voltage is the septum to IC test board cell wall spacing. This procedure was developed using a 1 GHz TEM cell with a septum to floor spacing of 45 mm and a GTEM cell with average septum to floor spacing of 45 mm over the port area. Other cells may not produce identical spectral output but may be used for comparative measurements, subject to their frequency and sensitivity limitations. The IC test board controls the geometry and orientation of the operating IC relative to the cell and eliminates any connecting leads within the cell these are on the backside of the board, which is outside the cell.


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DIN EN 61967-2:2006-03



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